芯片热测试的国际标准

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芯片热测试的国际标准，英文，内容包括：

[1] JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor
Devices).  This is the overview document for this series of specifications.
 
[2] JESD51-1, Integrated Circuit Thermal Measurement Method - Electrical Test Method
 
[3] JESD51-2, Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection
(Still Air)
 
[4] JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
 
[5] JESD51-4, Thermal Test Chip Guideline (Wire Bond Type Chip)
 
[6] JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment
Mechanisms
 
[7] JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions – Forced Convection

无插件，无病毒

(Moving Air)
 
[8] JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
 
[9] JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions – Junction-to-Board
 [10] JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
 
[11] JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
 
[12] JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
 
[13] JESDxx-yy, JEDEC Two-Resistor Compact Model Standard  [in the ballot process at the time of
publication]
 
[14] JESDxx-zz, DELPHI Compact Model Guideline  [in the ballot process at the time of publication]，大小：931 KB